Memory IC IS61NLP12836EC-200B3LI-TR product image

IS61NLP12836EC-200B3LI-TR

$6.38
  • Description:IC SRAM 4.5MBIT PAR 165TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:5bcf37734564 Category: Brand:

  
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IS61NLP12836EC-200B3LI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 4.5MBIT PAR 165TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS61NLP12836EC-200B3LI-TR

  • Description:IC SRAM 4.5MBIT PAR 165TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR
  • Memory Size:4.5Mbit
  • Memory Organization:128K x 36
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3.135V ~ 3.465V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-TBGA
  • Supplier Device Package:165-TFBGA (13x15)
  • Access Time:3.1 ns

Memory IC datasheet and documents for IS61NLP12836EC-200B3LI-TR

IS61NLP12836EC-200B3LI-TR

Memory IC Overview

The IS61NLP12836EC-200B3LI-TR is a 4 Mbit synchronous pipelined static random-access memory (SRAM) manufactured by ISSI. It features a data organization of 128K x 36 bits, supporting error correction code (ECC) functionality. The device operates with a maximum clock frequency of 200 MHz and provides an access time of 3.1 ns. It utilizes a 3.3 V I/O voltage range, specified between 3.135 V and 3.465 V, with a maximum power supply current of 210 mA. The component is housed in a 165-ball FBGA package suitable for surface mount technology and supports an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports synchronous pipelined architecture with ECC capability
  • Provides high-speed parallel interface operation
  • Designed for robust performance across industrial temperature ranges

Memory IC Applications

  • Networking equipment
  • Telecommunications systems
  • Industrial control applications

Memory IC Procurement Notes

Verify the specific suffix B3LI corresponds to the required 165-ball FBGA package configuration. Confirm that the TR suffix indicates tape-and-reel packaging if reel handling is required for assembly. Ensure the ECC feature is enabled in the system design as this variant includes parity or check bit support. Validate that the 3.3V I/O levels match the host controller logic requirements before finalizing procurement.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is necessary for high-throughput applications. The 200 MHz speed class suits systems requiring low latency and high bandwidth. Consider the 165-ball FBGA footprint for board space constraints. Verify that the host system can accommodate the ECC overhead inherent in the 36-bit organization compared to standard 32-bit memories.

Memory IC Part Context

This part belongs to the IS61NLP series of synchronous SRAMs from ISSI. It shares architectural similarities with other members like the IS61NLP51236 but differs in density and organization. The EC designation typically denotes enhanced commercial or specific feature sets within the product line. It serves as a high-performance memory solution replacing older asynchronous or lower-speed synchronous alternatives in modern embedded designs.

Memory IC Replacement Considerations

Check ISSI datasheets for pin-compatible alternatives within the IS61NLP family. Verify electrical compatibility for any cross-brand replacements, specifically focusing on I/O voltage levels and timing parameters.

IS61NLP12836EC-200B3LI-TRIS61NLP12836EC-200B3LI-TR
$6.38
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