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IS64WV102416FBLL-10CTLA3 is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 16MBIT PAR. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IS64WV102416FBLL-10CTLA3
- Description：IC SRAM 16MBIT PAR
- Series：-
- Mfr：ISSI, Integrated Silicon Solution Inc
- Package：Bulk
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Asynchronous
- Memory Size：16Mbit
- Memory Organization：1M x 16
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：10ns
- Voltage - Supply：2.4V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：48-TFSOP (0.724", 18.40mm Width)
- Supplier Device Package：48-TSOP I
- Access Time：10 ns
- Grade：Automotive
- Qualification：AEC-Q100
Memory IC datasheet and documents for IS64WV102416FBLL-10CTLA3
Memory IC Overview
The IS64WV102416FBLL-10CTLA3 is a 16 Mbit (1M x 16) asynchronous static random-access memory (SRAM) manufactured by ISSI. It operates within a supply voltage range of 2.4 V to 3.6 V and features a maximum access time of 10 ns. The device is housed in a 48-pin TSOP I package and supports surface-mount installation. It is designed for automotive temperature ranges, functioning reliably between -40°C and +125°C.
Memory IC Feature Summary
- Automotive-grade reliability with extended temperature operation up to 125°C
- High-speed asynchronous parallel interface with 10 ns access time
- Low-voltage operation compatible with 2.4 V to 3.6 V power supplies
Memory IC Applications
- Automotive electronic control units requiring high-speed data buffering
- Industrial systems operating in extreme thermal environments
- Embedded memory storage in automotive infotainment and safety modules
Memory IC Procurement Notes
Verify the specific suffix 'A3' confirms the automotive temperature grade and TSOP I package variant. Ensure compatibility with 2.4 V to 3.6 V logic levels. Confirm moisture sensitivity handling requirements prior to assembly. Cross-reference datasheet revisions for any pinout or electrical parameter updates.
Memory IC Selection Notes
Select this component when automotive qualification and wide temperature tolerance are mandatory. The 10 ns speed suits high-frequency asynchronous interfaces. Consider the 48-pin TSOP I footprint for board space constraints. Validate that the 16-bit word width aligns with system bus architecture requirements.
Memory IC Part Context
This part belongs to the IS64WV series of high-speed automotive SRAMs from ISSI. It shares architectural similarities with other members like the IS64WV204816BLL but offers lower density. The FBLL suffix typically denotes specific packaging and automotive compliance variations within the broader IS64WV family.
Memory IC Replacement Considerations
IS64WV102416FBLL-10TLI is a documented alternative offering identical electrical specifications and pinout but packaged in TSOP II instead of TSOP I. Verify mechanical clearance before substitution.
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