IS64WV51216EEBLL-10B2LA3-TR

$9.95

Description：IC SRAM 8MBIT PAR
Series：-
Mfr：ISSI, Integrated Silicon Solution Inc
Package：Tape & Reel (TR)

SKU:061f860d8439 Category: Memory IC Brand: ISSI, Integrated Silicon Solution Inc

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Product introduction

IS64WV51216EEBLL-10B2LA3-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 8MBIT PAR. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS64WV51216EEBLL-10B2LA3-TR

Description：IC SRAM 8MBIT PAR
Series：-
Mfr：ISSI, Integrated Silicon Solution Inc
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：SRAM
Technology：SRAM - Asynchronous
Memory Size：8Mbit
Memory Organization：512K x 16
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：10ns
Voltage - Supply：2.4V ~ 3.6V
Operating Temperature：-40°C ~ 125°C (TA)
Mounting Type：Surface Mount
Package / Case：48-TFBGA
Supplier Device Package：48-TFBGA (6x8)
Access Time：10 ns
Grade：Automotive
Qualification：AEC-Q100

Memory IC datasheet and documents for IS64WV51216EEBLL-10B2LA3-TR

IS64WV51216EEBLL-10B2LA3-TR

Memory IC Overview

The IS64WV51216EEBLL-10B2LA3-TR is an 8Mbit asynchronous static random-access memory (SRAM) manufactured by ISSI using CMOS technology. It features a storage organization of 512K words by 16 bits, providing high-speed data access with a maximum access time of 10 ns. The device operates within a supply voltage range of 2.4V to 3.6V and supports parallel interface communication. It is housed in a 48-TFBGA package measuring 6x8 mm and is qualified for automotive applications under AEC-Q100 standards. The component functions reliably across an extended industrial temperature range from -40°C to +125°C.

Memory IC Feature Summary

Automotive-grade qualification compliant with AEC-Q100 standards for reliable operation in vehicle environments.
High-speed asynchronous parallel interface enabling rapid data read and write operations.
Extended industrial temperature rating supporting stable performance in harsh thermal conditions.

Memory IC Applications

Automotive embedded systems requiring robust memory solutions
Industrial control units operating in extreme temperatures
Network equipment buffer memory

Memory IC Procurement Notes

Verify the specific suffix B2LA3 against the official datasheet to confirm pinout compatibility and electrical characteristics. Ensure the procurement channel provides traceability documentation required for automotive-grade components. Confirm that the reel packaging matches the specified quantity requirements for your production line. Check for RoHS compliance status if environmental regulations apply to your assembly process.

Memory IC Selection Notes

Select this component when automotive reliability and wide temperature tolerance are critical. The 10ns speed suits high-frequency bus interfaces. Compare power consumption metrics against alternatives if battery efficiency is a constraint. Ensure the PCB layout accommodates the 48-TFBGA footprint dimensions accurately.

Memory IC Part Context

This part belongs to the IS64WV51216 family of high-speed SRAMs designed for demanding applications. It shares architectural similarities with other members but differs in package type and specific qualification ratings. The TFBGA form factor allows for compact board designs compared to larger TSOP packages.

Memory IC Replacement Considerations

Direct pin-compatible substitutes may include other 512Kx16 SRAMs in 48-TFBGA packages. Verify voltage levels and access times match system requirements before substitution.