Memory IC IS66WVH8M8DALL-200B1LI product image

IS66WVH8M8DALL-200B1LI

$2.67
  • Description:IC PSRAM 64MBIT HYPERBUS 24TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:b73998958521 Category: Brand:

  
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IS66WVH8M8DALL-200B1LI is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC PSRAM 64MBIT HYPERBUS 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS66WVH8M8DALL-200B1LI

  • Description:IC PSRAM 64MBIT HYPERBUS 24TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:PSRAM
  • Technology:PSRAM (Pseudo SRAM)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:HyperBus
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:35ns
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:35 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS66WVH8M8DALL-200B1LI

IS66WVH8M8DALL-200B1LI

Memory IC Overview

The IS66WVH8M8DALL-200B1LI is a 64 Mbit (8M x 8) HyperRAM PSRAM IC manufactured by ISSI. It operates at a maximum clock frequency of 200 MHz with a typical access time of 40 ns and a write cycle time of 400 ns. The device supports a supply voltage range of 1.7 V to 1.95 V and functions within an ambient temperature range of -40°C to +85°C. It is housed in a 24-TFBGA (6x8) surface-mount package.

Memory IC Feature Summary

  • Supports the HyperBus interface for high-speed serial data transfer.
  • Integrates pseudo-SRAM technology for volatile memory storage.
  • Designed for low-voltage operation within specified industrial temperature limits.

Memory IC Applications

  • High-performance embedded systems requiring fast random access.
  • Industrial control units operating in wide temperature environments.
  • Consumer electronics utilizing compact surface-mount memory solutions.

Memory IC Procurement Notes

Verify the specific suffix B1LI against the manufacturer's current datasheet to confirm pinout and electrical characteristics match your design requirements. Ensure compatibility with the 1.7 V to 1.95 V power domain and validate that the 24-TFBGA footprint aligns with your PCB layout constraints before finalizing orders.

Memory IC Selection Notes

Select this component when a 64 Mbit capacity is required alongside a serial HyperBus interface rather than parallel alternatives. Consider the 40 ns access speed and 200 MHz clock rate for latency-sensitive applications. Confirm that the 24-ball TFBGA package size fits within the available board space compared to larger parallel PSRAM options.

Memory IC Part Context

This part belongs to the IS66/67WVH8M8DxLL family of HyperRAM devices from ISSI. It serves as a high-density, high-speed memory solution designed to replace traditional SRAM or DRAM in space-constrained designs. The HyperBus interface reduces pin count while maintaining performance suitable for modern microcontroller and processor architectures.

Memory IC Replacement Considerations

IS66WVH8M8DALL-200B1LI-TR is the tape-and-reel variant of this component. Verify if bulk packaging is required instead of the standard tube configuration typically associated with the non-TR suffix.

IS66WVH8M8DALL-200B1LIIS66WVH8M8DALL-200B1LI
$2.67
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