IS66WVO16M8DALL-200BLI-TR

Memory IC Overview

The IS66WVO16M8DALL-200BLI-TR is a 128 Mbit OctalRAM device manufactured by ISSI. It features an organization of 16M x 8 bits and operates at a maximum clock frequency of 200 MHz with a 5 ns access time. The component utilizes a single 1.8 V power supply, ranging from 1.7 V to 1.95 V, and draws a maximum current of 30 mA. It is housed in a 24-ball TFBGA package suitable for surface mount technology. The device supports an operating temperature range from -40°C to +85°C and complies with RoHS standards.

Memory IC Feature Summary

• Octal I/O interface supporting high-speed data transfer via SPI-compatible commands
• Pseudo SRAM architecture providing static RAM ease of use with dynamic RAM density
• Single 1.8V power supply operation for low voltage system integration

Memory IC Applications

• Portable consumer electronics requiring compact memory solutions
• Industrial control systems needing reliable data storage
• Automotive infotainment and instrument cluster displays

Memory IC Procurement Notes

Verify the specific suffix BLI-TR against the manufacturer's official datasheet to confirm tape and reel packaging specifications. Ensure the voltage rating matches your system design requirements. Check for moisture sensitivity levels prior to soldering. Confirm RoHS compliance status with the supplier documentation before finalizing procurement orders.

Memory IC Selection Notes

Select this component when high-density memory is required within a small footprint. The OctalRAM interface offers higher bandwidth compared to traditional parallel SRAMs. Consider the 24-ball TFBGA package constraints for PCB layout. Evaluate power consumption limits against the 30 mA maximum specification during active operations.

Memory IC Part Context

This part belongs to the ISSI OctalRAM family, designed to bridge the gap between fast SRAM and dense DRAM. It integrates a synchronous DRAM core with a pseudo-SRAM interface controller. This architecture simplifies system design by eliminating complex refresh cycles while maintaining high performance levels suitable for modern embedded applications.

Memory IC Replacement Considerations

Direct substitutes include other ISSI OctalRAM variants with compatible pinouts and electrical characteristics. Verify that alternative parts match the 128 Mbit capacity and 200 MHz speed grade. Ensure the replacement maintains the same 24-ball TFBGA package dimensions for mechanical compatibility.