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IS66WVO32M8DALL-200BLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC PSRAM 256MBIT SPI/OCT 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IS66WVO32M8DALL-200BLI-TR
- Description：IC PSRAM 256MBIT SPI/OCT 24TFBGA
- Series：-
- Mfr：ISSI, Integrated Silicon Solution Inc
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：PSRAM
- Technology：PSRAM (Pseudo SRAM)
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Octal I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：40ns
- Voltage - Supply：1.7V ~ 1.95V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IS66WVO32M8DALL-200BLI-TR
Memory IC Overview
The IS66WVO32M8DALL-200BLI-TR is a 256Mb OctalRAM device manufactured by ISSI. It features a 32M x 8 organization and operates at a maximum clock frequency of 200MHz with a 1.8V supply voltage. The component utilizes an octal peripheral interface protocol for high-speed data transfer. It is housed in a 24-ball TFBGA package and supports RoHS compliance standards.
Memory IC Feature Summary
- Supports the Octal Peripheral Interface (OPI) protocol for high-bandwidth serial communication
- Utilizes self-refreshing DRAM array technology to emulate pseudo-static RAM behavior
- Operates on a single 1.8V power supply rail for low-voltage system integration
Memory IC Applications
- High-throughput embedded memory systems requiring low pin counts
- Industrial control applications utilizing OPI-based architectures
- Automotive electronics demanding robust serial memory solutions
Memory IC Procurement Notes
Verify the specific suffix 'TR' indicates tape and reel packaging configuration during sourcing. Confirm that the 1.8V operating voltage aligns with target system power rails. Ensure the 24-ball TFBGA footprint matches the design layout constraints before finalizing procurement orders.
Memory IC Selection Notes
Select this component when high data rates are required alongside minimal I/O pin usage. The 200MHz speed rating suits applications needing rapid burst transfers. Consider the 1.8V requirement against available system voltages to ensure compatibility without additional level shifting circuitry.
Memory IC Part Context
This part belongs to the ISSI OctalRAM family, which combines the ease of SRAM interfaces with the density of DRAM arrays. These devices are designed to replace traditional parallel memories in space-constrained designs while offering superior performance through serial protocols.
Memory IC Replacement Considerations
Check for IS66WVO32M8DBLL-166BLI for similar capacity with different voltage or speed characteristics. Verify functional equivalence with other ISSI OctalRAM variants sharing the 24-ball TFBGA package and 256Mb density specifications.
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