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ISL12028IB27Z is listed in the Real Time Clock range at ChipApex. The manufacturer field lists Intersil. Its product description is IC RTC CLK/CALENDAR I2C 14SOIC. Review the specifications below when checking this part for your BOM.
The ISL12028IB27Z is a Real-Time Clock (RTC) integrated circuit manufactured by Renesas Electronics, formerly Intersil. It features an I2C bus interface and includes 512 bytes of EEPROM for data storage. The device supports standard date formats (YY-MM-DD-dd) and 24-hour time formats (HH:MM:SS). It operates within a supply voltage range of 2.7 V to 5.5 V and functions at temperatures between -40°C and +85°C. Housed in a 14-lead SOIC package, it incorporates battery backup switching to maintain timekeeping during power loss.
Availability for the ISL12028IB27Z is currently restricted or limited as indicated by distributor status. Verification of current stock levels and lead times should be conducted directly with authorized suppliers or the manufacturer. Due to potential obsolescence notices associated with this component family, confirm production status before finalizing procurement plans.
Select the ISL12028IB27Z when both real-time clocking and significant onboard non-volatile storage (512 B) are required in a single package. Ensure the design accommodates the 14-SOIC footprint and I2C electrical characteristics. Verify that the 2.7 V to 5.5 V supply range aligns with the system's power architecture and that the industrial temperature rating meets environmental requirements.
This component belongs to the ISL12028A series of low-power RTCs. It shares core specifications with variants like the ISL12028IVZ, differing primarily in packaging (SOIC vs. TSSOP) and specific ordering suffixes. The part represents a transition from legacy Intersil products now managed under the Renesas Electronics portfolio.
The ISL12028IVZ serves as a pin-compatible alternative offering identical electrical specifications but utilizes a TSSOP-14 package instead of SOIC-14. Designers must verify mechanical clearance and PCB layout compatibility when substituting between these package types.
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