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ISL28214FBZ-T7 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.
The ISL28214FBZ-T7 is a dual-channel, micropower operational amplifier from the Renesas ISL28214 series. It features rail-to-rail input and output capabilities with a gain-bandwidth product of 5 MHz and a slew rate of 2.5 V/µs. The device operates on a single supply voltage ranging from 1.8 V to 5.5 V, consuming 720 µA per channel. Key electrical specifications include an input offset voltage of 4 mV, input bias current of 20 pA, and input voltage noise density of 40 nV/√Hz. It is housed in an SOIC-8 surface-mount package and supports an extended operating temperature range from -40 °C to +125 °C.
Verify the specific suffix 'T7' indicates tape-and-reel packaging when sourcing components. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Check for end-of-life notifications or obsolescence warnings as older Intersil/Renesas products may have limited availability. Ensure moisture sensitivity level handling procedures are followed during assembly to prevent package damage.
Select this component when dual-channel performance is required alongside ultra-low power consumption. The rail-to-rail I/O capability makes it suitable for low-voltage single-supply applications where signal swing is critical. Compare against single-channel variants if only one amplifier is needed to reduce board space. Consider the SOIC-8 package dimensions for PCB layout compatibility compared to MSOP alternatives.
This part belongs to the ISL28214 family of general-purpose micropower operational amplifiers originally developed by Intersil and now manufactured by Renesas Electronics. The family includes single-channel (ISL28114) and quad-channel (ISL28414) variants sharing similar electrical characteristics. The FBZ suffix denotes the SOIC-8 package type, while the T7 suffix specifies the reel packaging format for automated assembly processes.
Publicly confirmed substitute part numbers were not identified in the provided source material.
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