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ISL28230FBZ-T13 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.
The ISL28230FBZ-T13 is a dual-channel precision operational amplifier manufactured by Renesas Electronics Corporation. It features a gain-bandwidth product of 12.5 MHz and a slew rate of 20 V/µs. The input offset voltage is specified at 300 µV, with an input bias current of 235 pA. Operating from a single supply voltage range of 4.5 V to 20 V, it draws a typical operating supply current of 5.8 mA. The device offers a common-mode rejection ratio of 90 dB and a power supply rejection ratio of 102 dB. Input voltage noise density is 14 nV/√Hz, while input noise current density is 9 fA/√Hz. It is housed in an SOIC-8 surface-mount package.
Verify the specific suffix T13 indicates reel packaging when ordering. Confirm the manufacturer part number matches exactly to ensure correct pinout and electrical specifications. Check RoHS compliance status if required by your manufacturing standards. Ensure the supplier provides valid traceability documentation for quality assurance purposes.
Select this component when both high speed and precision are required simultaneously. The 12.5 MHz bandwidth distinguishes it from slower zero-drift alternatives. Verify that the 20 V maximum supply voltage meets your system requirements. Consider the SOIC-8 footprint compatibility during PCB layout design.
This device belongs to the ISL28210 series of low-noise JFET operational amplifiers. It shares similar performance characteristics with other members of this family but offers dual-channel integration. The series is designed for applications demanding low noise and high speed without sacrificing precision.
ISL28210FBZ-T13 is a verified substitute offering identical electrical specifications and pin configuration. Ensure the replacement maintains the same package type and thermal characteristics for direct board-level interchangeability.
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