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ISL28230FRZ-T13 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP GP 2 CIRCUIT 8DFN. Review the specifications below when checking this part for your BOM.
The ISL28230FRZ-T13 is a dual-channel micro-power operational amplifier from the Renesas ISL28x30 series. It features zero-drift architecture with rail-to-rail input and output capabilities, optimized for single-supply operation from 1.8V to 5.5V or dual supplies of ±0.9V to ±2.75V. Key electrical parameters include a maximum input offset voltage of 40µV, typical supply current of 20µA per channel, gain-bandwidth product of 400kHz, and slew rate of 0.2V/µs. The device operates within an industrial temperature range of -40°C to +125°C and is housed in an 8-lead MSOP package.
Verify the specific suffix 'FRZ' against official Renesas documentation to confirm the exact package type (MSOP) and commercial/industrial temperature rating (-40°C to +125°C). Ensure compatibility with existing PCB footprints for 8-lead MSOP packages. Confirm availability status as older Intersil/Renesas parts may have end-of-life implications.
Select this component when low power consumption and high precision are required in space-constrained designs. The dual-channel configuration reduces board space compared to single-channel alternatives. Verify that the 400kHz bandwidth meets the application's frequency response requirements and that the 15mA output drive capability is sufficient for the load.
This part belongs to the ISL28x30 family of micropower, zero-drift amplifiers, which includes single-channel (ISL28130) and quad-channel (ISL28430) variants. The family shares similar electrical characteristics but differs in channel count and pinout configurations. The FRZ suffix indicates a specific tape-and-reel packaging option for automated assembly.
Direct replacements within the same family include ISL28230CBZ (SOIC package) or ISL28230CUZ (MSOP package), provided the temperature grade and packaging match the design requirements. Cross-family replacements require careful evaluation of pin compatibility and electrical parameter differences.
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