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ISL28246FBZ is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.
The ISL28246FBZ is a dual, general-purpose operational amplifier manufactured by Renesas Electronics Corporation. It features rail-to-rail input and output capabilities, ensuring maximum dynamic range in single-supply applications. The device offers a gain bandwidth product of 5 MHz and a slew rate of 1.9 V/µs. Key electrical specifications include an input offset voltage of 30 µV and an input bias current of 16 nA. Supply current per channel is typically 1 mA. It operates within a temperature range of -40°C to +125°C and is housed in an 8-SOIC package.
Verify the manufacturer origin, as Intersil was acquired by Renesas. Confirm the specific suffix indicates the dual-channel variant. Ensure the package matches the required 8-SOIC footprint. Check for RoHS compliance status if required by your manufacturing standards. Validate the operating temperature range against your environmental constraints.
Select this component when rail-to-rail performance is critical for single-supply systems. Compare the 5 MHz bandwidth against higher-speed alternatives if signal fidelity at higher frequencies is required. Consider the 1 mA supply current for power-sensitive designs. Evaluate the 30 µV offset voltage against precision requirements for low-level signal amplification.
This part belongs to the family of rail-to-rail operational amplifiers originally developed by Intersil and now managed by Renesas. It serves as a general-purpose solution for analog signal processing. The dual-channel configuration allows for cost-effective implementation of differential or multi-stage amplification circuits in compact spaces.
Consult official datasheets for direct pin-compatible replacements from Renesas or other manufacturers. Verify that substitute parts meet the same rail-to-rail input/output specifications and bandwidth requirements. Ensure thermal and electrical characteristics align with the original design constraints.
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