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ISL8842AMUZ-T is listed in the AC DC Converters, Offline Switchers range at ChipApex. The manufacturer field lists Intersil. Its product description is IC OFFLINE SWITCH MULT TOP 8MSOP. Review the specifications below when checking this part for your BOM.
The ISL8842AMUZ-T is an offline switching controller from the ISL884xA series, designed for high-performance power conversion applications. It supports Boost and Flyback topologies with a maximum switching frequency of 2 MHz. The device operates within a temperature range of -55°C to +125°C and features a 96% maximum duty cycle. It provides a 1 A output current drive capability. The component is housed in an 8-MSOP package (0.118 inch / 3.00 mm width) and is supplied in a reel format.
Verify the specific suffix 'T' indicates reel packaging when sourcing. Confirm the manufacturer origin as Intersil or Renesas Electronics, as both entities are associated with this product line. Ensure the package type matches the required 8-MSOP footprint for PCB layout compatibility. Check for any obsolescence notices or lifecycle status updates from the manufacturer before finalizing procurement plans.
Select this component for applications requiring high-frequency operation up to 2 MHz to minimize passive component size. The wide operating temperature range makes it suitable for industrial environments. Consider the 8-MSOP package constraints for thermal management and board space. Verify that the 1 A drive current meets the requirements of the intended power MOSFETs in the target topology.
This part belongs to the ISL884xA family of high-performance offline switchers. The series includes variants such as ISL8840A, ISL8841A, and ISL8843A, which offer different pinouts and feature sets while sharing core performance characteristics. These controllers are designed to replace older generation discrete solutions with integrated functionality.
Direct substitutes within the same family include ISL8840AMBZ, ISL8841AMBZ, ISL8843AMBZ, and ISL8844AMBZ. Note that these alternatives may differ in package style (SOIC vs MSOP) or specific pin configurations. Verify functional compatibility and pinout alignment before swapping components.
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