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ISOUSB211DPR is listed in the Signal Buffers, Repeaters, Splitters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is LOW EMISSIONS, HIGH/FULL/LOW SPE. Review the specifications below when checking this part for your BOM.
The ISOUSB211DPR is a galvanically-isolated USB repeater supporting Low Speed (1.5 Mbps), Full Speed (12 Mbps), and High Speed (480 Mbps) signaling rates compliant with USB 2.0 standards. It operates within a VBUS voltage range of 4.25V to 5.5V and features internal LDOs generating 3.3V and 1.8V supplies. The device utilizes a silicon dioxide insulation barrier rated for 5700 VRMS isolation voltage and supports automatic speed detection, role reversal for OTG/Type-C DRP, and programmable equalization. It functions across an ambient temperature range of -40°C to +125°C in a 28-SSOP package.
Verify the specific ordering suffix 'DPR' corresponds to the tape and reel packaging configuration required for automated assembly processes. Confirm that the component meets all relevant safety certifications including UL 1577 and IEC 60601-1 for the intended application environment. Ensure compatibility with the design's isolation voltage requirements before finalizing procurement.
Select this component when designing systems requiring robust galvanic isolation between USB hosts and peripherals. The integrated LDOs simplify power supply design by eliminating external regulators for 3.3V and 1.8V rails. Consider the SSOP-28 package dimensions for PCB layout constraints and verify thermal dissipation capabilities under maximum operating conditions.
This part belongs to the ISOUSB211 family of isolated USB repeaters manufactured by Texas Instruments. The 'DPR' suffix specifically denotes the SSOP-28 package variant supplied in tape and reel format. This family is designed to replace traditional optocoupler-based solutions with higher performance and lower electromagnetic interference.
Direct replacements must match the 28-SSOP footprint and support USB 2.0 High Speed signaling. Verify that alternative components offer comparable isolation ratings and pinout compatibility to ensure seamless integration without redesigning the printed circuit board.
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