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ISP521-2BLG is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 2CH TRANS 8-DIP. Review the specifications below when checking this part for your BOM.
The ISP521-2BLG is a high-density mounting phototransistor optically coupled isolator manufactured by Isocom Components. It integrates an infrared light emitting diode and an NPN silicon photo transistor within a space-efficient dual in line plastic package. The device provides electrical isolation between systems with different potentials and impedances, ensuring signal transmission stability. Key specifications include a minimum current transfer ratio of 50%, a high isolation voltage of 5.3 kV RMS, and a collector-emitter breakdown voltage of 55 V. All electrical parameters are 100% tested to ensure consistent performance.
Verify the exact suffix configuration against official Isocom documentation to confirm lead form options such as surface mount or tape and reel variants. Ensure compatibility with required safety certifications like UL or VDE before procurement. Confirm that custom electrical parameter selections align with specific application needs, as standard versions may not cover all unique design constraints.
Select this component when high-density mounting is required alongside robust electrical isolation capabilities. The device is suitable for applications demanding a minimum current transfer ratio of 50% and high breakdown voltage tolerance. Consider the availability of custom electrical selections if standard parameters do not fully satisfy specific circuit design requirements or environmental operating conditions.
The TLP521 series represents a family of optically coupled isolators designed for space-efficient installations. These devices utilize infrared LEDs and NPN silicon phototransistors to provide reliable signal transmission across isolated circuits. The series offers various packaging options to accommodate different assembly techniques and spatial constraints in electronic designs.
TLP521-2
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