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ISP621-4XSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISO 5.3KV 4CH TRANS 16-SMD. Review the specifications below when checking this part for your BOM.
The ISP621-4XSM is a surface-mount quad-channel optocoupler manufactured by Isocom Components. It integrates four independent infrared LEDs with phototransistor outputs in a single package, providing electrical isolation between input and output circuits. The device features a standard DIP-4 footprint adapted for surface mounting, facilitating automated assembly processes. Key electrical characteristics include a maximum forward voltage of 1.3V per channel and a typical rise time of 2 microseconds. The unit offers high isolation capability with a rated isolation voltage of 5300Vrms, ensuring robust performance in noisy environments. It operates within a temperature range of -30°C to 100°C and complies with UL safety standards.
Verify the specific suffix designation against the manufacturer's official datasheet to confirm pinout compatibility and lead frame material. Ensure that the surface-mount variant matches the target PCB land pattern dimensions. Confirm that the isolation voltage ratings meet the system's safety requirements before integration. Cross-reference the component marking codes with official documentation to authenticate genuine parts from authorized distributors.
Select this component when space constraints require multiple isolated channels in a single surface-mount package. Consider the 5300Vrms isolation rating for applications demanding high dielectric strength between circuit domains. Evaluate the 2µs rise time against the required signal bandwidth for data transmission integrity. Ensure the operating temperature range aligns with the environmental conditions of the final application to maintain consistent current transfer ratio performance.
This part belongs to the ISP series of optocouplers from Isocom Components, designed as alternatives to legacy through-hole devices. The series emphasizes miniaturization while maintaining high isolation performance. It serves as a modern replacement for older DIP-packaged quad optocouplers, offering improved soldering reliability and reduced board space consumption in dense electronic designs.
Public confirmed substitute part numbers are not available in the provided source material.
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