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ISP817X-1 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The ISP817X-1 is a single-channel phototransistor optocoupler from the ISP series, manufactured by Isocom Components. It features a high-density mounting design with a 4-pin PDIP package and through-hole installation. The device utilizes an LED input for AC or DC signals and provides a phototransistor output. Key electrical parameters include a maximum forward voltage of 1.4V, a typical rise time of 4μs, and a typical fall time of 3μs. It offers a minimum isolation voltage of 5300Vrms and operates within a temperature range of -30°C to 100°C.
Verify that the specific suffix '-1' aligns with the manufacturer's official pinout and lead form specifications for the ISP817X series. Confirm compliance with required safety standards such as UL recognition (File No. E91231) and VDE approval if applicable to the target market. Ensure the selected variant matches the required operating temperature range and isolation voltage ratings for the intended application environment.
Select this component when a single-channel isolation solution with a standard DIP footprint is required. Consider the 5300Vrms isolation rating for safety-critical interfaces. Evaluate the 4μs rise time against system speed requirements. Compare against other ISP series variants like ISP817BLSM for surface mount options or different current transfer ratios if higher gain is needed.
This part belongs to the ISP series of high-density mounting phototransistor optically coupled isolators produced by Isocom Components. The series includes various channel counts and package types, such as the 4-element ISP847X in a DIP-16 package. The 'X' designation typically indicates specific lead form variations approved under UL and VDE standards.
No public confirmed substitute part numbers are available in the provided documentation.
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