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The ISP825XG is a single-channel optically coupled isolator from Isocom Components, featuring an infrared LED input and an NPN silicon photodarlington output. Housed in a surface-mount DIP package with a 10mm lead spread variant, it provides high-density mounting capabilities. The device offers a minimum current transfer ratio of 600% and an isolation voltage of 5.3kVRMS (7.5kVPK). It operates within a temperature range of -30°C to +100°C and includes UL certification for safety compliance.
Verify the specific suffix configuration upon ordering. The 'G' designation indicates a 10mm lead spread option, while 'SM' denotes surface mount and 'SMT&R' indicates tape and reel packaging. Confirm that the selected package variant aligns with the target PCB footprint and assembly requirements to ensure proper mechanical fit and electrical connectivity.
Select this component when high current transfer efficiency is required for driving loads directly without additional amplification. The photodarlington output structure supports higher gain compared to standard phototransistors. Ensure the application environment remains within the specified operating temperature limits and that the isolation voltage rating meets the system's safety clearance requirements.
This part belongs to the ISP8xx series of high-density mounting photodarlington optically coupled isolators. The series integrates infrared LEDs with NPN silicon photodarlington transistors in compact packages. The ISP825XG represents a specific configuration within this family, optimized for applications requiring reliable galvanic isolation and high signal gain in space-constrained designs.
Public confirmed substitute part numbers are not available in the provided documentation.