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The ISP827-3 is a high-density, dual-channel transistor output optocoupler manufactured by Isocom Components 2004 LTD. It features two independent phototransistor outputs within a single DIP-8 plastic package. The device provides a minimum collector-emitter breakdown voltage of 35 V and supports a maximum forward current of 50 mA. It offers a nominal current transfer ratio of 200% and a maximum dark power dissipation of 100 nA. The unit is rated for an insulation voltage of 5300 V and operates within a temperature range of -55 °C to 100 °C.
Verify the specific suffix designation against official datasheets to confirm lead form variations such as STD or G forms. Ensure compliance requirements match project specifications, specifically UL and VDE approvals. Confirm pinout compatibility with existing PCB layouts before integration. Cross-reference manufacturer documentation for any recent packaging or specification updates.
Select this component when dual-channel isolation is required within a limited footprint. The high current transfer ratio suits applications demanding efficient signal coupling. Verify thermal management needs given the 100 °C maximum operating temperature. Consider the 35 V breakdown voltage limit for low-voltage signal interfaces. Evaluate package constraints against available DIP-8 mounting options.
This part belongs to the ISP827X series of high-density phototransistor optically coupled isolators. It shares functional similarities with the ISP817 and ISP847 models but offers dual-channel architecture. The series is designed for applications requiring robust electrical isolation in compact electronic assemblies.
The ISP827XD from Isocom Components 2004 LTD is documented as a similar substitute. Verify pinout and electrical parameters before substitution.