ISP827BSMT&R

Overview

The ISP827BSMT&R is a surface-mount phototransistor optocoupler manufactured by Isocom Components. It features a single channel with an NPN phototransistor output and operates within a temperature range of -55°C to 100°C. The device provides a minimum isolation voltage of 5300 Vrms, ensuring robust electrical separation between input and output circuits. Key performance parameters include a typical rise time of 4µs and a fall time of 3µs. The unit supports a maximum forward current of 50 mA and offers a high current transfer ratio ranging from 200% to 600%. Packaged in a compact DIP-8 form factor suitable for automated assembly.

Feature Summary

• High-density mounting design optimized for surface-mount technology applications
• Provides reliable galvanic isolation via optical transmission path
• Features fast switching characteristics with defined rise and fall times
• Compliant with UL recognition and VDE approval standards

Applications

• Industrial control systems requiring signal isolation
• Power supply units needing feedback loop isolation
• Data communication interfaces for noise immunity
• Microprocessor input/output circuit isolation

Procurement Notes

Verify the specific suffix 'SMT&R' confirms the tape-and-reel packaging format required for your automated pick-and-place equipment. Ensure the lead configuration matches your PCB footprint specifications. Confirm that the CTR range meets your circuit's logic threshold requirements before finalizing procurement orders.

Selection Notes

Select this component when high isolation voltage is critical for safety compliance in low-power signal transmission. The surface-mount package facilitates reduced board space usage compared to through-hole alternatives. Consider the specific current transfer ratio binning if precise gain stability is necessary for your analog or digital interface design.

Part Context

This part belongs to the ISP827 series of high-density optocouplers designed for modern electronic assemblies. The series emphasizes compact packaging without compromising isolation performance. It serves as a direct replacement for legacy through-hole devices in space-constrained designs while maintaining equivalent electrical characteristics and regulatory approvals.

Replacement Considerations

Check pinout compatibility with existing PCB layouts when substituting through-hole variants. Verify that the surface-mount termination style matches your soldering process capabilities. Ensure the thermal dissipation characteristics of the SMD package are adequate for your operating environment.