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IW611HN/A1CK is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC RF BLE. Review the specifications below when checking this part for your BOM.
The IW611HN/A1CK is a highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6 (802.11ax) and Bluetooth 5.4 single-chip solution by NXP. It combines a full-function Wi-Fi subsystem with MAC, baseband, direct-conversion RF, PA, LNA, and switch, eliminating the need for an external front-end module. The independent Bluetooth 5.4 subsystem supports LE Audio, 2 Mbit/s data rates, and extended broadcast. Interfaces include SDIO 3.0 for Wi-Fi and UART for Bluetooth. Available in 116-QFN and 132-WLCSP packages, it operates from 0°C to 70°C or -40°C to 85°C.
Verify the specific suffix A1CK against the official datasheet to confirm package type and temperature range. Ensure host interfaces match SDIO 3.0 and UART requirements. Confirm RoHS3 compliance status. Check for required external passive components despite high integration. Validate antenna configuration support for single or dual setups.
Select this component for cost-sensitive designs requiring reduced BOM complexity due to integrated RF front-end. Suitable for applications needing simultaneous Wi-Fi 6 and Bluetooth 5.4 connectivity without external FEMs. Consider interface compatibility with SDIO and UART hosts. Evaluate thermal performance within specified operating ranges.
The IW611 belongs to NXP's wireless solutions portfolio focusing on Wi-Fi 6 and multi-radio technologies. It complements other models like IW610 and IW612, offering a 1x1 dual-band configuration. This series targets IoT and industrial markets with high integration levels.
Public confirmed substitute part numbers are not available in the provided documentation. Consult NXP official resources for cross-reference information.
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