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IW624HN/A0ZMCPMP is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IW624HN/A0ZMCPMP. Review the specifications below when checking this part for your BOM.
The IW624HN/A0ZMCPMP is a highly integrated System-on-Chip (SoC) supporting 2x2 Tri-band Wi-Fi 6/6E and Dual Bluetooth 5.2 or Single Bluetooth 5.3. It operates across 2.4 GHz, 5 GHz, and 6-6 GHz bands with a peak PHY rate of 1.2 Gbps. The device implements MU-MIMO, OFDMA, and Target Wake Time (TWT). It integrates TX power amplifiers, RX low noise amplifiers, and switches for four-antenna designs. Interfaces include SDIO/PCIe for Wi-Fi and UART for Bluetooth.
Verify the specific suffix A0ZMCPMP against official NXP documentation to confirm package type and temperature range. Ensure host processor compatibility with the required PCIe or SDIO interfaces. Confirm that the selected variant meets the necessary regional regulatory certifications for the target market deployment.
Select this component when tri-band coverage and concurrent dual-mode Bluetooth are required. The integrated PA and LNA simplify RF design compared to discrete solutions. Consider the secure subsystem requirements for applications demanding firmware authentication and secure boot capabilities.
This part belongs to the IW624 family of wireless combo solutions from NXP Semiconductors. It represents a significant evolution in integrated connectivity, offering higher data rates than previous generations while maintaining compact form factors suitable for modern consumer and industrial electronics.
Public confirmed substitute part numbers: IW624HN/A0ZMCSMP.
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