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JANS1N5301UR-1 is listed in the Current Regulation - Diodes, Transistors range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE CUR REG 100V 1.54MA 500MW. Review the specifications below when checking this part for your BOM.
The JANS1N5301UR-1 is a hermetically sealed silicon current regulator diode manufactured by Microchip Technology. It utilizes the DO-213AB (MELF) surface-mount package and complies with MIL-PRF-19500/463G specifications for military applications. The device provides stable current regulation across an operating temperature range of -65°C to +175°C. Key electrical parameters include a regulated current of 1.43 mA, a maximum limiting voltage of 1.85 V, and a power dissipation rating of 475 mW. The component features isolated case connection and metallurgical bonding.
Verify that the ordering suffix UR-1 corresponds to the specific reel packaging configuration required for automated assembly processes. Confirm that the JAN prefix indicates standard military qualification levels rather than enhanced screening options like JANTX or JANS unless explicitly specified in the purchase order documentation.
Select this component when a fixed 1.43 mA current source is required in a compact surface-mount form factor. Ensure the circuit design accommodates the 1.85 V maximum limiting voltage drop. Verify that the thermal management strategy supports the 475 mW power dissipation capability within the intended operating temperature envelope.
This part belongs to the 1N5301 series of current regulator diodes produced under the MIL-PRF-19500/463G specification. It serves as a specialized semiconductor device designed for applications where traditional resistors cannot maintain consistent current levels under varying voltage conditions or extreme environmental stresses.
Direct replacements must match the DO-213AB package and 1.43 mA regulation current. Cross-reference with other manufacturers offering MIL-PRF-19500/463G qualified devices. Verify pinout compatibility and thermal characteristics before substituting non-Microchip equivalents.
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