JANTX1N6342/TR

Single Zener Diodes Overview

The JANTX1N6342/TR is a Zener diode manufactured by Microchip Technology, designed for surface-mount applications. It features a nominal Zener voltage of 56V and operates at a test current of 2.2mA. The device exhibits a maximum impedance of 100 Ohms. Packaged in the SQ SMT form factor, it is supplied in tape and reel quantities for automated assembly processes.

Single Zener Diodes Feature Summary

• Provides stable voltage regulation within specified operational limits
• Engineered for reliable performance in surface-mount circuit designs
• Constructed to withstand defined thermal and electrical stress conditions

Single Zener Diodes Applications

• Voltage reference circuits requiring precise potential levels
• Overvoltage protection stages in sensitive electronic systems
• Biasing networks for semiconductor components

Single Zener Diodes Procurement Notes

Verify the exact suffix configuration against official Microchip documentation to ensure compatibility with specific packaging or qualification requirements. Confirm that the requested variant matches the intended manufacturing process and environmental standards before finalizing acquisition orders.

Single Zener Diodes Selection Notes

Select this component when a 56V regulation point is required in a compact surface-mount footprint. Ensure the circuit design accommodates the specified test current and impedance characteristics. Validate that the operating temperature range aligns with the system's thermal environment and reliability targets.

Single Zener Diodes Part Context

This part belongs to the JANTX series of Zener diodes, which are typically characterized for enhanced reliability compared to standard commercial grades. The series offers various voltage options packaged in small outline forms suitable for high-density PCB layouts.

Single Zener Diodes Replacement Considerations

Consult official substitution guides for compatible alternatives. Verify that any substitute maintains identical voltage ratings, package dimensions, and thermal specifications to ensure seamless integration without redesign.