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JANTXV1N5303-1 is listed in the Current Regulation - Diodes, Transistors range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE CUR REG 100V 1.76MA 500MW. Review the specifications below when checking this part for your BOM.
The JANTXV1N5303-1 is a current regulator diode manufactured by Microchip Technology, designed for high-reliability applications. It operates with a regulated current of 1.76 mA and supports a maximum voltage of 100 V. The device dissipates up to 475 mW of power and is housed in a DO-7-2 through-hole package. It functions within an extended temperature range from -55 °C to +175 °C. This component belongs to the MIL-PRF-19500/463 military series, ensuring robust performance in demanding environments.
Verify the specific ordering suffix against official Microchip documentation to confirm exact qualification levels and testing standards. Ensure compatibility with existing board layouts regarding the DO-7-2 package dimensions. Confirm that the 1.76 mA regulation current meets the design requirements before finalizing procurement orders.
Select this component when a precise 1.76 mA current source is required in space-constrained through-hole designs. Consider the 100 V breakdown limit and 475 mW power dissipation capabilities during thermal analysis. Evaluate the -55 °C to +175 °C operating range against environmental specifications to ensure adequate margin for peak operational temperatures.
This part is part of the JAN (Joint Army-Navy) series, indicating its origin in military specification standards. It falls under the broader category of current regulator diodes produced by Microchip's defense division. The 'TXV' suffix typically denotes a specific reliability tier within the MIL-PRF-19500/463 family, distinguishing it from standard commercial variants.
Direct substitutes include other parts within the 1N5303 series such as the JAN1N5303-1 or JANTX1N5303-1, provided the specific reliability grade matches the application needs. Verify pinout compatibility and thermal characteristics before swapping.
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