Diode Arrays JANTXV1N6642UBCA product image

JANTXV1N6642UBCA

$25.17
  • Description:DIODE ARRAY GP 75V 300MA UB
  • Series:-

SKU:2ee92ba4bc65 Category: Brand:

  
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JANTXV1N6642UBCA is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ARRAY GP 75V 300MA UB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for JANTXV1N6642UBCA

  • Description:DIODE ARRAY GP 75V 300MA UB
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • Diode Configuration:1 Pair Common Anode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):75 V
  • Current - Average Rectified (Io) (per Diode):300mA
  • Voltage - Forward (Vf) (Max) @ If:1.2 V @ 100 mA
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):20 ns
  • Current - Reverse Leakage @ Vr:500 nA @ 75 V
  • Operating Temperature - Junction:-65°C ~ 175°C
  • Mounting Type:Surface Mount
  • Package / Case:3-SMD, No Lead
  • Supplier Device Package:UB
  • Grade:Military
  • Qualification:MIL-PRF-19500/578

Diode Arrays datasheet and documents for JANTXV1N6642UBCA

JANTXV1N6642UBCA

Diode Arrays Overview

The JANTXV1N6642UBCA is a silicon switching diode manufactured by Microchip Technology, designed for high-reliability applications. It features a peak reverse voltage of 75 V and supports a maximum forward current of 300 mA with a surge capability of 2.5 A. The device exhibits a fast recovery time of 5 ns and a low forward voltage of 1.2 V at specified currents. Operating within a temperature range of -65°C to +175°C, it utilizes a hermetically sealed D-5D-2 surface mount package.

Diode Arrays Feature Summary

  • Hermetically sealed construction using internal metallurgical bonded design for enhanced environmental resistance
  • Qualified under MIL-PRF-19500/578N specifications ensuring strict military-grade performance standards
  • Fast switching characteristics with minimal capacitance suitable for high-speed digital logic circuits

Diode Arrays Applications

  • Computer peripheral equipment requiring rapid signal processing
  • Magnetic core and thin-film memory decoding or encoding systems
  • Plated-wire memory array addressing circuits

Diode Arrays Procurement Notes

Verify the specific suffix 'UBCA' against official Microchip documentation to confirm exact pinout and packaging variations. Ensure compliance with MIL-PRF-19500/578N quality levels during acquisition. Confirm RoHS status as military variants may differ from commercial equivalents. Validate lot traceability requirements for critical defense or aerospace deployments.

Diode Arrays Selection Notes

Select this component when hermetic sealing and extreme temperature tolerance are mandatory. The JANTXV level indicates tighter parameter tolerances compared to standard JAN grades. Consider the D-5D-2 package constraints for PCB layout. Evaluate thermal management needs given the wide operating range and potential power dissipation in dense arrays.

Diode Arrays Part Context

This part belongs to the JEDEC registered 1N66xx series of small-signal switching diodes. It shares functional similarities with 1N6638 and 1N6643 but offers specific voltage and current ratings optimized for computer logic applications. The UBCA suffix typically denotes a specific tape-and-reel or bulk packaging configuration within the military qualification line.

Diode Arrays Replacement Considerations

  • JANTX1N6642U
  • 1N6642USe3

Diode Arrays FAQ

What is the maximum junction temperature for this diode?

The maximum operating temperature is +175°C.

Is the device available in a lead-free configuration?

Military qualified versions like JANTXV often have specific material compositions; verify RoHS compliance details in the specific datasheet as they may differ from commercial parts.

What is the typical reverse leakage current?

The reverse current is specified at 500 nA for certain configurations, though values vary based on the specific quality level and test conditions defined in the datasheet.

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