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JANTXV1N6642US/TR is listed in the Single Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE STANDARD 100V 300MA D5B. Review the specifications below when checking this part for your BOM.
The JANTXV1N6642US/TR is a silicon switching diode manufactured by Microchip Technology, designed for high-speed signal and computer applications. It features a single configuration in an SQ SMT D-5D-2 package. Key electrical parameters include a peak reverse voltage of 75 V, a forward current of 300 mA, and a maximum surge current of 2.5 A. The device exhibits a fast recovery time of 5 ns with a forward voltage of 1.1 V and a reverse current of 500 nA. Maximum diode capacitance is 5 pF. It operates within a temperature range of -65 C to +175 C.
Verify the specific suffix /TR indicates reel packaging when ordering. Confirm that the JANTXV quality level meets the required radiation tolerance and performance specifications for the target environment. Ensure compatibility with the SQ SMT D-5D-2 footprint during PCB layout. Check for RoHS non-compliance status if environmental regulations apply to the final assembly process.
Select this component for applications requiring hermetic sealing and high-temperature operation up to 175 C. The low capacitance and fast recovery time make it suitable for high-frequency signal processing. Compare against JAN or JANTX levels if cost reduction is necessary and lower qualification standards are acceptable. Ensure the 75 V reverse voltage rating exceeds the circuit's maximum operating voltage.
This part belongs to the 1N6642 series of JEDEC registered switching diodes produced by Microchip (formerly Microsemi). The series includes variants like 1N6638 and 1N6643, all sharing similar fast-switching characteristics. The JANTXV designation signifies a specific military quality tier within the MIL-PRF-19500 framework, ensuring stricter testing than commercial equivalents.
JAN1N6642US
The maximum operating temperature is +175 C.
Yes, the diode features voidless hermetically sealed glass packaging with metallurgical bonding.
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