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Product Detailed Parameters
- Description：TRANS 4PNP QUAD 50V 800MA 6-SMD
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Transistor Type：4 PNP (Quad)
- Current - Collector (Ic) (Max)：800mA
- Voltage - Collector Emitter Breakdown (Max)：50V
- Vce Saturation (Max) @ Ib, Ic：1V @ 50mA, 500mA
- Current - Collector Cutoff (Max)：10nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce：100 @ 150mA, 10V
- Power - Max：1W
- Frequency - Transition：-
- Operating Temperature：-65°C ~ 200°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：6-SMD, No Lead
- Supplier Device Package：6-SMD
- Grade：Military
- Qualification：MIL-PRF-19500/559
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Overview
The JANTXV2N6989U/TR is a hermetically sealed, ceramic surface-mount device consisting of four silicon NPN transistors. Manufactured by Microchip Technology under MIL-PRF-19500/559 specifications, it utilizes a 20-pin package designed to minimize circuit board area and device weight. The component features a collector-emitter breakdown voltage of 50V and a maximum continuous collector current of 800mA per transistor. It supports a junction temperature range from -65°C to +200°C with a total power dissipation capability of 1W.
Feature Summary
- Hermetically sealed ceramic construction for environmental protection
- Quad NPN configuration within a single compact surface-mount package
- Military-grade screening and processing per MIL-PRF-19500/559 standards
Applications
- General switching circuits
- Amplification stages
- Signal processing systems
- Radio transmission equipment
- Logic gate implementations
Procurement Notes
Verify the specific suffix 'TXV' against official datasheets to confirm military qualification levels. Ensure compatibility with high-temperature soldering profiles required for ceramic packages. Confirm that the 20-pin footprint matches the target PCB layout constraints before finalizing procurement orders.
Selection Notes
Select this component when space and weight reduction are critical design factors requiring a quad NPN array. Consider the 20-pin ceramic package requirements for assembly processes. Evaluate thermal management needs given the 1W total power dissipation limit across all four internal transistors in the enclosed package.
Part Context
This part belongs to the 2N6989 family of quad NPN transistor arrays. It shares core electrical characteristics with through-hole variants but differs significantly in packaging technology. The surface-mount ceramic version targets applications where miniaturization and ruggedness outweigh standard plastic package availability.
Replacement Considerations
Direct pin-compatible replacements include other 20-pin ceramic quad NPN arrays processed to MIL-PRF-19500/559. Verify equivalent thermal resistance and power derating curves. Cross-reference with JAN2N6989U series parts if military screening is not strictly required.
