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JBB105DYHN is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Sullins Connector Solutions. Its product description is CONN EDGE DUAL FML 210POS 0.050. Review the specifications below when checking this part for your BOM.
The JBB105DYHN is a dual-sided edge card connector manufactured by Sullins Connector Solutions. It features 210 positions arranged in two rows of 105 contacts with a 0.050-inch (1.27mm) pitch. The connector utilizes female, cantilever spring contacts made from beryllium copper, finished with 30.0µin (0.76µm) gold plating. Designed for through-hole mounting and solder termination, it accommodates a board thickness of 0.062 inches (1.57mm). The housing is constructed from polyamide PA9T nylon 9T and operates within a temperature range of -65°C to 150°C.
Verify the specific suffix DYHN against official Sullins documentation to confirm contact type, plating thickness, and insulation material. Ensure compatibility with target PCB stack-up dimensions and thermal requirements. Confirm RoHS compliance status and moisture sensitivity level prior to integration into production workflows.
Select this model when a dual-sided edge connector with cantilever contacts is required for 0.062-inch thick boards. The beryllium copper alloy provides superior mechanical resilience compared to phosphor bronze alternatives. Verify that the 0.050-inch pitch aligns with the mating card layout and that the operating temperature range meets environmental specifications.
This component belongs to the JBB series of edge card connectors from Sullins Connector Solutions. The series is characterized by its use of beryllium copper contacts and polyamide insulation. Variations within the series differ primarily in contact orientation, plating specifications, and mounting features while maintaining consistent dimensional standards for board integration.
Cross-reference part numbers such as GBB105DYHN or RCB105DHND for alternative contact materials or configurations. Verify that substitute components maintain identical pitch, row count, and board thickness compatibility before implementation.
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