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JD54F373SRA is listed in the Latches range at ChipApex. The manufacturer field lists National Semiconductor. Its product description is IC D-TYPE TRANSP SGL 8:8 20CDIP. Review the specifications below when checking this part for your BOM.
The JD54F373SRA is an octal transparent D-type latch manufactured by National Semiconductor. It features eight D-type latches with tri-state outputs, housed in a 20-pin CERDIP package. The device operates within a supply voltage range of 4.5 V to 5.5 V and supports a low-level output current of 32 mA. Propagation delay is specified at 7 ns at 5 V. The component functions as a non-inverting logic circuit with one functional unit containing eight channels.
Verify the manufacturer designation carefully, as National Semiconductor's logic division was acquired by Texas Instruments. Confirm that the specific JD54F373SRA part number corresponds to the original National Semiconductor production run rather than a TI equivalent. Check datasheet revisions to ensure pinout and electrical characteristics match the required design specifications before procurement.
Select this component when an octal latch with tri-state outputs is required for bus systems. Ensure the application environment accommodates the commercial temperature range of 0°C to +70°C. Verify that the CERDIP package style is compatible with the available PCB footprint and assembly equipment. Confirm power supply stability within the 4.5 V to 5.5 V range to maintain signal integrity.
This component belongs to the 54F/74F series of high-speed Schottky TTL logic devices. The 54F series typically denotes military-grade reliability standards, while the 74F series indicates commercial grade. The JD prefix identifies the specific packaging and material variant produced by National Semiconductor. This family provides faster switching speeds compared to standard 74LS logic families.
The SN74F373NSR from Texas Instruments serves as a direct functional substitute. Both parts share identical logical functionality and pin configurations. Verify that the replacement package type meets mechanical constraints.
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