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The JM38510/34101B2A is a military-grade octal D-type flip-flop manufactured by Texas Instruments under the SN54F374 series. It features edge-triggered data storage with three-state outputs for bus interfacing. The component utilizes a ceramic dual in-line package (CDIP) with 20 pins, designed for through-hole mounting. It operates within a supply voltage range of 4.5 V to 5.5 V and supports TTL input logic levels. The device ensures reliable performance across an extended temperature range from -55°C to +125°C, suitable for harsh environments.
Verify that the procurement source provides valid traceability documentation, including the Certificate of Conformance and test reports required for MIL-PRF-38535 Class B components. Confirm the part number suffix matches the specific thermal and electrical specifications. Ensure the supplier handles ceramic packages appropriately to prevent mechanical damage during transit and storage.
Select this component when designing systems requiring high-speed octal latching with bus isolation capabilities in extreme conditions. The SN54F374 series offers faster switching than standard LS variants. Consider the CDIP package size for board layout constraints. Verify that the application circuitry supports the required 5V logic levels and current drive specifications for the three-state outputs.
This part belongs to the SN54F374 family of octal D-type flip-flops. It is classified under MIL-PRF-38535 standards for integrated circuits. The 'JM' prefix indicates a military grade qualification. The 'BRA' or 'B2A' suffixes typically denote specific package styles or testing variations within the ceramic DIP form factor, ensuring compatibility with legacy military connector footprints.
Direct replacements include other SN54F374 variants meeting MIL-PRF-38535 Class B requirements. Cross-reference pinouts to ensure compatibility with existing PCB layouts. Verify that substitute parts maintain the same propagation delay characteristics and power consumption profiles to avoid signal integrity issues in high-speed designs.