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The Littelfuse K1050G is a standard bidirectional SIDAC from the Kxxxzy series, functioning as a silicon voltage-triggered switch. It features a breakover voltage (VBO) range of 95 V to 113 V and a repetitive peak off-state voltage (VDRM) of 90 V. The device supports an on-state RMS current (IT(RMS)) of 1 A at 50/60 Hz with a junction temperature below 125°C. Key electrical parameters include a maximum dynamic holding current (IH) of 150 mA, a peak on-state voltage (VTM) of 1.5 V, and a breakover current (IBO) of 10 μA. It withstands a single-cycle non-repetitive surge current (ITSM) of 20 A at 60 Hz. The component utilizes a DO-15 through-hole package and operates within a junction temperature range of -40°C to 125°C.
Verify the specific suffix 'G' corresponds to the DO-15 through-hole package configuration required for your assembly process. Confirm that the bulk packaging quantity aligns with production needs. Ensure the ordering part number matches the exact voltage rating requirements of the target application circuit design.
Select this component when a breakover voltage between 95 V and 113 V is required for AC triggering applications. The DO-15 package is suitable for through-hole mounting where higher thermal resistance compared to surface mount options is acceptable. Ensure the circuit can handle the 1 A RMS current limit and provides sufficient current sinking to drop below the 150 mA holding current threshold for reliable turn-off.
The K1050G belongs to the Kxxxzy series of standard bidirectional SIDACs manufactured by Littelfuse. This series offers various breakover voltages ranging from 79 V to 330 V across different package types including DO-15, DO-214, and TO-92. The 'K1050' designation specifically indicates the 95 V to 113 V trigger voltage range within this standardized product family.
Other K1050 variants such as K1050S (DO-214) or K1050E (TO-92) share identical electrical characteristics but differ in physical package and mounting style. Direct substitution requires verifying footprint compatibility and thermal management capabilities.