Memory IC K4F8E304HB-MGCJ product image

K4F8E304HB-MGCJ

$3.83
  • Description:LPDDR4 8Gb x32 3733 Mbps 1.1v 20
  • Series:-
  • Mfr:Samsung Semiconductor, Inc.
  • Package:Tray

SKU:a28a278c79bb Category: Brand:

  
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K4F8E304HB-MGCJ is listed in the Memory IC range at ChipApex. The manufacturer field lists Samsung Semiconductor, Inc.. Its product description is LPDDR4 8Gb x32 3733 Mbps 1.1v 20. Review the specifications below when checking this part for your BOM.

Memory IC specifications for K4F8E304HB-MGCJ

  • Description:LPDDR4 8Gb x32 3733 Mbps 1.1v 20
  • Series:-
  • Mfr:Samsung Semiconductor, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:-
  • Memory Size:8Gbit
  • Memory Organization:256M x 32
  • Memory Interface:Parallel
  • Clock Frequency:1866 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-25°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:200-TFBGA
  • Supplier Device Package:-
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for K4F8E304HB-MGCJ

K4F8E304HB-MGCJ

Memory IC Overview

The K4F8E304HB-MGCJ is an 8 Gbit LPDDR4 SDRAM manufactured by Samsung Semiconductor. It features a 256M x 32 organization with a 32-bit data bus width and supports data rates up to 3733 Mbps at a clock frequency of 1866 MHz. Operating at a low voltage of 1.1V, the component is housed in a compact 200-ball FBGA package measuring 10mm x 15mm x 0.9mm. Designed for industrial applications, it maintains functionality within a temperature range of -25°C to +85°C.

Memory IC Feature Summary

  • LPDDR4 architecture optimized for high bandwidth and reduced power consumption in mobile platforms
  • Compact 200-ball FBGA packaging designed to minimize internal footprint
  • Low voltage operation at 1.1V to enhance energy efficiency
  • Industrial-grade temperature rating for reliable performance in harsh environments

Memory IC Applications

  • Smartphones and mobile computing devices
  • Automotive infotainment systems
  • Industrial control equipment
  • IoT gateways

Memory IC Procurement Notes

Verify the specific speed grade suffix (MGCJ) corresponds to the required 3733 Mbps rate and -25°C to +85°C operating range. Confirm the 200-ball FBGA package dimensions match the design constraints. Ensure compatibility with the host controller's LPDDR4 interface specifications before integration.

Memory IC Selection Notes

Select this component when a 32-bit wide memory interface is required within a space-constrained PCB layout. The 8 Gbit density provides sufficient capacity for embedded Linux or complex firmware tasks. Consider the 1.1V supply requirement and ensure the system power management unit can deliver stable current at the specified operating temperatures.

Memory IC Part Context

This part belongs to Samsung’s LPDDR4 product line, representing the fourth generation of Low Power Double Data Rate synchronous dynamic random-access memory. It succeeds previous LPDDR generations by offering improved bandwidth per watt, making it suitable for next-generation mobile and embedded processing architectures requiring efficient data throughput.

Memory IC Replacement Considerations

Check for alternative Samsung LPDDR4 parts with identical 32-bit width and compatible speed grades. Verify that any substitute maintains the same 200-ball FBGA footprint and industrial temperature rating to ensure mechanical and thermal compatibility without redesigning the motherboard.

K4F8E304HB-MGCJK4F8E304HB-MGCJ
$3.83
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