K4S510432D-UC75T00

$5.95

Description：IC DRAM 512MBIT LVTTL 54TSOP II
Series：-
Mfr：Samsung Semiconductor, Inc.
Package：Tape & Reel (TR)

SKU:fcf54836e9ed Category: Memory IC Brand: Samsung Semiconductor, Inc.

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Product introduction

K4S510432D-UC75T00 is listed in the Memory IC range at ChipApex. The manufacturer field lists Samsung Semiconductor, Inc.. Its product description is IC DRAM 512MBIT LVTTL 54TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for K4S510432D-UC75T00

Description：IC DRAM 512MBIT LVTTL 54TSOP II
Series：-
Mfr：Samsung Semiconductor, Inc.
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM
Memory Size：512Mbit
Memory Organization：128M x 4
Memory Interface：LVTTL
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：3V ~ 3.6V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：54-TSOP (0.400", 10.16mm Width)
Supplier Device Package：54-TSOP II
Access Time：65 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for K4S510432D-UC75T00

K4S510432D-UC75T00

Memory IC Overview

The K4S510432D-UC75T00 is a 64 Mbit (8M x 4) Synchronous DRAM manufactured by Samsung Semiconductor, Inc. It utilizes a 54-pin TSOP II lead-free package and operates at a PC133 speed grade of 7.5 ns with a default CAS latency of 3. The device features four internal banks, an LVTTL interface, and requires a 3.3 V power supply. It supports standard refresh cycles of 8K/64ms and is designed for commercial temperature ranges from 0°C to 70°C.

Memory IC Feature Summary

Four-bank architecture supporting page burst access modes
LVTTL interface compatible with standard logic levels
Lead-free and halogen-free compliant packaging

Memory IC Applications

Personal computer memory systems
Consumer electronics requiring compact memory solutions
Industrial control equipment operating within commercial temperatures

Memory IC Procurement Notes

Verify the component matches the exact density and organization specifications required for your design. Confirm that the PCB layout accommodates the 54-pin TSOP II footprint dimensions accurately. Ensure the system voltage aligns with the specified 3.3 V requirement for proper operation.

Memory IC Selection Notes

Select this part when a 64 Mbit capacity with a narrow 4-bit width is necessary. The PC133 speed grade provides adequate performance for general computing tasks. Consider the lead-free package if environmental compliance is a priority for the manufacturing process.

Memory IC Part Context

This component belongs to Samsung's SDRAM product line, specifically utilizing the D-die generation. It is part of a broader family of synchronous dynamic random-access memories designed for high-density applications in consumer and industrial markets.

Memory IC Replacement Considerations

Compatible substitutes include other Samsung SDRAM parts with matching 64 Mbit density, 4-bit organization, and 54-pin TSOP II packages. Verify speed grades and pin configurations before implementation.