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K6F4008U2D-FF70 is listed in the Memory IC range at ChipApex. The manufacturer field lists Samsung Semiconductor, Inc.. Its product description is SRAM ASYNC SLOW 4MB 512Kx8 3V 48. Review the specifications below when checking this part for your BOM.
Memory IC specifications for K6F4008U2D-FF70
- Description：SRAM ASYNC SLOW 4MB 512Kx8 3V 48
- Series：-
- Mfr：Samsung Semiconductor, Inc.
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Asynchronous
- Memory Size：4Mbit
- Memory Organization：512K x 8
- Memory Interface：Parallel
- Clock Frequency：-
- Write Cycle Time - Word, Page：70ns
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：-
- Supplier Device Package：48-FBGA
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for K6F4008U2D-FF70
Memory IC Overview
The K6F4008U2D-FF70 is a high-speed CMOS static RAM organized as 512K x 8 bits, fabricated using Samsung's advanced CMOS process technology. It operates with a 3V supply voltage and features a parallel memory interface. The device supports asynchronous slow operation with a 48ns access time. It is designed for surface mount mounting in a 48-FBGA package. The operating temperature range extends from -40°C to 85°C (TA). This volatile memory component is classified under EAR99.
Memory IC Feature Summary
- High-speed CMOS static RAM organization
- Advanced CMOS process technology fabrication
- Asynchronous slow operation mode
Memory IC Applications
- Data processing systems
- Embedded memory storage
- Industrial control applications
Memory IC Procurement Notes
Verify the specific suffix FF70 against official Samsung documentation to confirm pinout and electrical characteristics. Confirm the 48-FBGA package type matches your PCB footprint requirements. Check current product status as listings may indicate obsolete or discontinued status. Ensure compatibility with 3V logic levels for your target circuit design.
Memory IC Selection Notes
Select this component when a 512K x 8 bit SRAM configuration is required for low-power applications. Consider the 48ns access speed for systems not requiring ultra-high frequency performance. Evaluate the 48-FBGA package constraints for board space limitations. Verify that the -40°C to 85°C industrial temperature range meets environmental specifications.
Memory IC Part Context
This part belongs to Samsung's SRAM family, distinct from the K6X series which offers different densities and speeds. The K6F series typically targets specific embedded memory needs with optimized power consumption. Compare with similar 512Kx8 devices from other manufacturers if supply chain diversification is necessary.
Memory IC Replacement Considerations
Check for direct pin-to-pin replacements within the Samsung K6F series. Verify equivalent organizations such as 512Kx8 with compatible 3V operation. Ensure replacement packages match the 48-FBGA form factor.
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