Memory IC K6X0808C1D-GF70T00 product image

K6X0808C1D-GF70T00

$3.19
  • Description:SRAM ASYNC SLOW 256K 32Kx8 28-S
  • Series:-
  • Mfr:Samsung Semiconductor, Inc.
  • Package:Tape & Reel (TR)

SKU:e9ce66372a52 Category: Brand:

  
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K6X0808C1D-GF70T00 is listed in the Memory IC range at ChipApex. The manufacturer field lists Samsung Semiconductor, Inc.. Its product description is SRAM ASYNC SLOW 256K 32Kx8 28-S. Review the specifications below when checking this part for your BOM.

Memory IC specifications for K6X0808C1D-GF70T00

  • Description:SRAM ASYNC SLOW 256K 32Kx8 28-S
  • Series:-
  • Mfr:Samsung Semiconductor, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Asynchronous
  • Memory Size:256Kbit
  • Memory Organization:32K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:70ns
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Supplier Device Package:28-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for K6X0808C1D-GF70T00

K6X0808C1D-GF70T00

Memory IC Overview

The K6X0808C1D-GF70T00 is a 256K-bit (32K x 8) asynchronous static random-access memory (SRAM) manufactured by Samsung Semiconductor. It utilizes low-power CMOS technology and operates within a supply voltage range of 4.5V to 5.5V. The device features a parallel interface with a maximum write cycle time of 70ns. It is housed in a 28-pin Small Outline Package (SOP).

Memory IC Feature Summary

  • Asynchronous operation for flexible system integration without clock synchronization requirements.
  • Low-power CMOS construction designed to minimize energy consumption during active and standby modes.
  • Parallel data interface supporting standard word-based read and write operations.

Memory IC Applications

  • Embedded systems requiring fast local data storage.
  • Industrial control units needing reliable volatile memory.
  • Consumer electronics devices utilizing standard logic levels.

Memory IC Procurement Notes

Verify the specific suffix GF70 against the required timing specifications, as other variants may differ. Confirm the 28-SOP package availability matches your PCB footprint requirements. Ensure the manufacturer is Samsung Semiconductor, Inc., as generic listings may not reflect original components. Cross-reference the datasheet for absolute maximum ratings before implementation.

Memory IC Selection Notes

Select this component when a 32Kx8 capacity is required with asynchronous access. The 70ns speed class suits applications where moderate latency is acceptable. Consider the 28-pin SOP package constraints for board layout. Compare power consumption metrics against newer alternatives if battery life is critical.

Memory IC Part Context

This part belongs to the K6X series of SRAMs, which are widely used in legacy and industrial designs. The K6X0808C1D variant defines the core density and organization. The GF70 suffix indicates the specific speed grade and package type, distinguishing it from faster or differently packaged versions within the same family.

Memory IC Replacement Considerations

Direct substitutes include K6X0808C1D-GF55T00 for faster performance or K6X0808C1D-BF70 for alternative packaging. Verify pin compatibility and electrical characteristics before swapping. Generic SRAM replacements may require firmware adjustments due to timing differences.

K6X0808C1D-GF70T00K6X0808C1D-GF70T00
$3.19
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