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The KBPC10/15/2516FP is a single-phase silicon bridge rectifier from Diotec Semiconductor, rated for a maximum alternating input voltage of 1000 V and a repetitive peak reverse voltage (VRRM) of 1600 V. It provides a maximum rectified output current (IFAV) of 10 A at a case temperature of 115°C with a 300 cm² cooling fin, or 20 A at 55°C. The device features a forward voltage drop below 1.2 V and a peak forward surge current (IFSM) of 270 A at 50 Hz. It utilizes an isolated plastic case with an aluminum baseplate and Fast-on terminals.
Verify the specific ordering suffix to confirm terminal type and compliance status. The FP suffix indicates Fast-on terminals, while WP denotes wire terminals. Suffixes -Q and -AQ denote AEC-Q101 compliance or qualification respectively. Confirm UL recognition file E175067 if required for end-product certification. Ensure thermal management aligns with the specified derating curves.
Select based on the required reverse voltage rating, ensuring VRRM exceeds the circuit's peak inverse voltage. Consider the thermal environment; IFAV decreases significantly as case temperature rises above 55°C. Verify that the PCB layout accommodates the Fast-on connector dimensions or allows for direct soldering. Check if automotive-grade AEC-Q101 variants are necessary for the target application reliability.
This component belongs to the KBPC series of single-phase bridge rectifiers manufactured by Diotec Semiconductor. The series offers various current ratings (10A, 15A, 25A) and voltage options (up to 1800V). The KBPC10/15/2516FP specifically represents the 1600V variant within this family, designed for general-purpose industrial and commercial rectification tasks requiring robust isolation and high surge capability.
Direct substitutes include other KBPC10/15/25 series parts from Diotec with matching voltage ratings. Cross-manufacturer replacements must match the 1600V VRRM, 10A IFAV, TO-205AB package outline, and terminal configuration. Verify thermal resistance and forward voltage characteristics to ensure equivalent performance in the existing thermal design.