Microprocessors KMPC8270CZQMIBA product image

KMPC8270CZQMIBA

$62.17
  • Description:IC MPU MPC82XX 266MHZ PBGA516
  • Series:MPC82xx
  • Mfr:NXP USA Inc.
  • Package:Box

SKU:73e183f2794c Category: Brand:

  
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KMPC8270CZQMIBA is listed in the Microprocessors range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MPU MPC82XX 266MHZ PBGA516. Review the specifications below when checking this part for your BOM.

Microprocessors specifications for KMPC8270CZQMIBA

  • Description:IC MPU MPC82XX 266MHZ PBGA516
  • Series:MPC82xx
  • Mfr:NXP USA Inc.
  • Package:Box
  • Core Processor:PowerPC G2_LE
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:266MHz
  • Co-Processors/DSP:Communications; RISC CPM
  • RAM Controllers:DRAM, SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100Mbps (3)
  • SATA:-
  • USB:USB 2.0 (1)
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:516-BBGA
  • Supplier Device Package:516-PBGA (27x27)
  • Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART

Microprocessors datasheet and documents for KMPC8270CZQMIBA

KMPC8270CZQMIBA

Microprocessors Overview

The KMPC8270CZQMIBA is a PowerQUICC II microprocessor from NXP Semiconductors, based on the MPC82xx family. It features a single-core 32-bit G2_LE integer processor running at 266 MHz or 333 MHz depending on the specific variant configuration. The device integrates PCI, USB, and Ethernet interfaces alongside a Communications Processor Module (CPM) supporting HDLC. It operates within an extended temperature range of -40°C to 105°C and utilizes a 516-ball BGA package.

Microprocessors Feature Summary

  • Integrates a dual-issue G2_LE core for high-performance instruction execution
  • Includes integrated PCI, USB, and 10/100 Ethernet controllers
  • Features a Communications Processor Module (CPM) with HDLC support
  • Designed for robust operation in extended industrial temperature environments

Microprocessors Applications

  • Telecommunications infrastructure equipment
  • Network routing and switching devices
  • Industrial control systems requiring extended temperature tolerance
  • Embedded communication gateways

Microprocessors Procurement Notes

Verify the exact frequency rating (266 MHz vs 333 MHz) and suffix codes against official NXP documentation before procurement. Ensure compatibility with existing board designs regarding the 516-BBGA footprint and 3.3V I/O voltage levels. Confirm that the specific revision matches project requirements for interface availability and thermal performance specifications.

Microprocessors Selection Notes

Select this component when a dedicated communications processor with integrated networking interfaces is required. It is suitable for applications needing hardware acceleration for protocol processing via the CPM. Consider power consumption and thermal dissipation capabilities inherent to the BGA package when designing the system environment.

Microprocessors Part Context

This part belongs to the NXP MPC82xx series of PowerQUICC II processors. These devices are designed for embedded communication applications, combining a PowerPC-compatible core with specialized peripherals. The series supports various integration levels of PCI, USB, and Ethernet, targeting high-volume telecommunications and networking markets.

Microprocessors Replacement Considerations

Direct substitutes include other MPC8270 variants such as MPC8270CVRMIBA or MPC8270VVUPEA, provided pinout and feature sets align. Verify electrical characteristics and software compatibility when transitioning between different suffixes within the same family.

KMPC8270CZQMIBAKMPC8270CZQMIBA
$62.17
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