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L6004D3RP is listed in the Triacs range at ChipApex. The manufacturer field lists Littelfuse Inc.. Its product description is TRIAC SENS GATE 600V 4A TO252. Review the specifications below when checking this part for your BOM.
The Littelfuse L6004D3RP is a bidirectional triac from the Teccor Lxx04xx series, housed in a TO-252-3 (DPAK) surface-mount package. It supports an RMS on-state current of 4 A and a rated repetitive off-state voltage of 600 V. Key electrical parameters include a maximum holding current of 5 mA, a gate trigger current of 3 mA, and a gate trigger voltage of 2 V. The device exhibits a low on-state voltage of 1.6 V and a leakage current of 5 uA at VDRM. It operates within a temperature range of -40 C to +110 C.
Verify component authenticity by cross-referencing the manufacturer part number L6004D3RP with official Littelfuse documentation. Confirm that the received units match the specified TO-252-3 package and series designation. Ensure compliance with RoHS and REACH standards as indicated in the product specifications before integration into final assemblies.
Select this component when a 600 V rating and 4 A continuous current capacity are required in a surface-mount form factor. The sensitive gate characteristic makes it suitable for logic-level driving interfaces. Compare against standard gate variants if higher noise immunity is needed, or consider alternative packages if thermal dissipation requirements exceed the DPAK capabilities.
This triac belongs to the Teccor Lxx04xx family of 4 Amp sensitive and standard triacs manufactured by Littelfuse. The series provides options for both sensitive and standard gate sensitivities across various voltage ratings. The L6004D3RP specifically addresses applications needing 600 V blocking capability with a compact SMD footprint.
Potential substitutes include other 600 V, 4 A triacs in TO-252 packages from Littelfuse or competitors. Verify gate trigger current compatibility to ensure proper drive circuit interfacing. Check thermal resistance values to confirm adequate heat dissipation performance in the target application environment.
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