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LA 55-P/SP2 is listed in the Current Sensors range at ChipApex. The manufacturer field lists LEM USA Inc.. Its product description is SENSORS. Review the specifications below when checking this part for your BOM.
The LA 55-P/SP2 is a PCB-mounted current transducer from the LA series, manufactured by LEM USA Inc. It utilizes closed-loop Hall effect technology for precise AC/DC current measurement. The device features a primary nominal current (IPN) of 50 A and a measuring range of 0 to ±100 A. It operates on a single supply voltage of 15 V, with an operating range of 11.4 V to 15.75 V. The sensor has a 12.7 × 7 mm primary through-hole aperture and provides a secondary output current of 500 mA. It supports bidirectional current flow and includes a reference terminal.
Verify the specific suffix SP2 against official LEM documentation to confirm pinout and electrical characteristics match your design requirements. Ensure the supply voltage remains within the 11.4 V to 15.75 V range during operation. Confirm that the PCB footprint aligns with the mechanical dimensions provided in the manufacturer's datasheet to avoid assembly issues.
Select this component when a 50 A nominal current rating and ±100 A measuring range are required for PCB-integrated applications. The closed-loop architecture offers superior performance compared to open-loop sensors, particularly regarding temperature stability and linearity. Consider the 12.7 × 7 mm aperture size to ensure compatibility with the busbar or cable diameter in your system design.
The LA 55-P/SP2 belongs to LEM's LA series of industrial and railway current sensors. This series is designed for robust performance in demanding environments, utilizing advanced Hall effect principles. The SP2 suffix typically denotes a specific packaging or pin configuration variant within the broader LA product family, intended for surface-mount or through-hole PCB integration.
LA 55-P/SP1 is a documented variant within the same series, differing primarily in packaging or pin configuration details as indicated by the suffix change. Verify if the SP1 variant meets the specific mechanical and electrical interface requirements of the target application before substitution.
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