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LA6584M-MPB-E is listed in the Full Half-Bridge (H Bridge) Drivers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC HALF BRIDGE DRVR 1.6A MFP16FS. Review the specifications below when checking this part for your BOM.
The LA6584M-MPB-E is a single-phase bipolar fan motor driver manufactured by onsemi. It utilizes BTL output linear drive to achieve silent operation for brushless DC motors. The device supports a maximum current of 1.6A and operates within a temperature range of -55 °C to +125 °C. It is housed in a 16-pin MFP16FS package with dimensions of 10 x 4 x 1.5mm.
Verify the specific suffix 'MPB-E' against official onsemi documentation to confirm pinout, thermal characteristics, and RoHS compliance status. Ensure the MFP16FS package type matches your PCB footprint requirements. Cross-reference the part number with authorized distributors to avoid counterfeit components, as generic listings may not reflect the exact manufacturing revision or testing standards required for industrial fan applications.
Select this component when silent operation is critical for single-phase bipolar fans. The linear drive method offers high efficiency but requires consideration of thermal management due to the 1.6A current rating. Verify that the operating voltage and load characteristics align with the H Bridge driver capabilities. The wide temperature range makes it suitable for demanding environments where standard drivers might fail.
This part belongs to onsemi's power management and motor driver portfolio, specifically targeting cooling solutions. It complements other motor control ICs by providing a specialized solution for low-noise fan applications. The MFP16FS package allows for compact integration into space-constrained electronic devices requiring reliable thermal regulation.
Check for direct substitutes like the LA6584M-TLM-E if different packaging is needed. Ensure any replacement maintains the 1.6A current rating and BTL linear drive functionality. Verify compatibility with existing control signals and thermal dissipation designs before swapping components.
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