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LAV-AT-X70-3LFG676I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Lattice Semiconductor Corporation. Its product description is LATTICE AVANT MID-RANGE GENERAL. Review the specifications below when checking this part for your BOM.
The Lattice LAV-AT-X70-3LFG676I is a MachXO3LF field-programmable gate array from the Lattice Semiconductor Corporation. It features 70,000 logic cells and operates at a core voltage of 1.2V. The device includes 480 Kbits of embedded block RAM and 512 Kbits of user flash memory for configuration storage. It supports dual boot functionality and offers security features such as bitstream encryption. The component is housed in a 676-ball FineLine BGA package with a 1.0 mm pitch, designed for industrial temperature ranges.
Verify the specific ordering suffix against the official Lattice Semiconductor datasheet to confirm package type, temperature grade, and security options. Ensure compatibility with existing board layouts regarding the 676-ball FBGA footprint and thermal requirements. Cross-reference the part number with authorized distributors to avoid counterfeit components.
Select this model when a balance of moderate logic density and low power consumption is required. The integrated flash memory simplifies design by removing the need for external configuration devices. Consider the 1.2V core voltage for energy efficiency compared to higher voltage alternatives. Verify that the I/O count meets interface requirements before finalizing the selection.
This component belongs to the MachXO3LF family, which focuses on secure, low-power applications. It shares architectural similarities with other MachXO3 devices but distinguishes itself through integrated flash memory. The family targets markets demanding high reliability and instant-on functionality in compact form factors.
Direct replacements within the MachXO3LF family should be verified for pin-to-pin compatibility and resource equivalence. Check Lattice documentation for recommended cross-references based on logic cell count and I/O availability. Ensure any substitute maintains the same package dimensions and thermal characteristics.
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