LB1935T-TLM-E

Overview

The LB1935T-TLM-E is a fully integrated bipolar motor driver manufactured by onsemi. It combines control logic and power stages in a single package, designed for driving bipolar stepper motors. The device features a parallel interface for straightforward system integration. It is housed in a compact 10-MSOP (Micro10) package with a width of 3.00 mm. The component operates within standard industrial temperature ranges and supports reel packaging for automated assembly processes.

Feature Summary

• Fully integrated design combining control and power stages
• Simplified system integration via parallel interface
• Compact Micro10/MSOP package footprint

Applications

• Bipolar stepper motor control systems
• General purpose motion control applications
• Automated equipment drive circuits

Procurement Notes

Verify the specific suffix TLM-E against official onsemi documentation to confirm pinout and thermal characteristics. Confirm RoHS compliance status through current datasheets. Ensure the 10-MSOP package dimensions match PCB layout requirements. Check for any recent product change notices affecting manufacturing sites or materials.

Selection Notes

Select this component when a compact solution for bipolar stepper motors is required. The parallel interface suits designs where GPIO availability is sufficient. Consider the MSOP package size for space-constrained boards. Verify voltage and current ratings align with the specific motor load requirements before finalizing the design.

Part Context

This part belongs to onsemi's Treo platform family, leveraging BCD 65nm technology. It falls under the Motor / Motion / Ignition Controllers & Drivers category. The device is designed for robust performance in automotive and industrial environments, offering a balance of integration and ease of use for motor control tasks.

Replacement Considerations

Check for direct pin-to-pin replacements within the LB19xx series. Verify that alternative drivers support the same bipolar motor type and parallel interface protocol. Ensure package compatibility with existing footprints.