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LC4064V-75TN44I is listed in the Complex Programmable Logic Devices range at ChipApex. The manufacturer field lists Lattice Semiconductor Corporation. Its product description is IC CPLD 64MC 7.5NS 44TQFP. Review the specifications below when checking this part for your BOM.
The LC4064V-75TN44I is a Complex Programmable Logic Device (CPLD) from the Lattice ispMACH 4000V family. It features 64 macrocells organized into 4 Logic Array Blocks (LABs) and provides 30 user I/O pins. The device operates at a supply voltage between 3.0 V and 3.6 V, with a maximum operating frequency of 400 MHz and a typical propagation delay of 7.5 ns. It utilizes EEPROM technology for non-volatile configuration and supports in-system programmability. The component is housed in a 44-pin TQFP package and functions within an industrial temperature range of -40°C to +105°C.
Verify the specific suffix 'TN44I' against the manufacturer's current datasheet to confirm pinout compatibility and electrical specifications. Ensure that the required programming tools support the ispMACH 4000V architecture for successful configuration. Check for any recent product change notices regarding package markings or material composition updates.
Select this model when 64 macrocells are sufficient for the design complexity. The 7.5 ns speed grade offers a balance between performance and power consumption. Consider the TQFP-44 package constraints for PCB layout. Compare against the LC4064C variant if lower power consumption is prioritized over higher speed capabilities.
This component belongs to the Lattice ispMACH 4000V series, which succeeded earlier generations like the ispMACH 4000. The 'V' designation indicates the specific process generation offering improved performance characteristics compared to previous versions. It serves as a drop-in replacement for legacy CPLDs requiring similar density and I/O counts.
The LC4064V-75T44I is listed as obsolete, with the LC4064V-75TN44I identified as a direct available substitute. Verify pin-to-pin compatibility before transitioning designs from older leaded packages to the current tin-nickel-gold plated variants.
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