LC823450XATBG

Audio Special Purpose Overview

The LC823450XATBG is an ultra-low power, 32-bit, 192 kHz high-resolution audio processing system-on-chip (SoC) by onsemi. It integrates dual ARM Cortex-M3 cores and a proprietary LPDSP32 DSP core with 1656 kB of internal SRAM. The device features hard-wired MP3 encoder/decoder, WMA/AAC decoding, and analog peripherals including a Class-D stereo headphone amplifier, 6-band equalizer, and ADCs/DACs. Designed for portable sound solutions, it supports USB 2.0, SD/eMMC interfaces, and Bluetooth protocol stacks to extend battery life in voice recorders and wearable audio applications.

Audio Special Purpose Feature Summary

• Dual ARM Cortex-M3 cores and proprietary LPDSP32 DSP core
• Hard-wired MP3 encoder/decoder supporting VBR up to 320 Kbps
• Integrated Class-D stereo headphone amplifier and 16-bit audio DAC
• USB 2.0 Host/Device controller with integrated PHY

Audio Special Purpose Applications

• Sound Recorders
• Wearable Audio Players
• Bluetooth Headsets
• Smart Phone Accessories

Audio Special Purpose Procurement Notes

Verify the specific package code suffix against the functional difference table. The 'XA' or 'XB' suffix indicates single-core variants, while 'RA' or 'RB' denotes dual-core configurations. Confirm that the required memory controllers (SDRAM/External) and GPIO counts match the design requirements for the selected package variant before ordering.

Audio Special Purpose Selection Notes

Select based on core count and peripheral availability. Single-core packages (TA/XA/XB) lack SDRAM and External Memory Controllers, whereas dual-core packages (RA/RB) include them. Ensure the chosen package supports the necessary ADC conversion speed (5 MHz vs 20 MHz) and GPIO interrupt channels required by the application architecture.

Audio Special Purpose Part Context

The LC823450 series serves as a low-power audio SoC for portable devices. The XATBG designation specifies the WLCSP154 package variant. This family replaces discrete audio processors and amplifiers by integrating DSP, codec, and power amp functions into a single chip to reduce board space and component count.

Audio Special Purpose Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult onsemi for current lifecycle status and potential obsolescence management strategies.