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LC823460XBHBKTBG is listed in the Audio Special Purpose range at ChipApex. The manufacturer field lists onsemi. Its product description is IC AUDIO PROCESSOR LSI 154WLCSP. Review the specifications below when checking this part for your BOM.
The LC823460XBHBKTBG is an audio processor LSI manufactured by onsemi, belonging to the Audio Special Purpose category. It is housed in a 154-ball WLCSP package and utilizes a Tape & Reel (TR) mounting type for surface mount applications. The component functions as a dedicated integrated circuit for audio processing tasks. Specific electrical parameters such as supply voltage, operating temperature range, interface types, and channel counts are not provided in the available documentation.
Verify the specific ordering suffix KTBG with the manufacturer or authorized distributors to confirm exact availability and any potential variations in function or qualification status associated with this suffix. Ensure that the Tape & Reel packaging format aligns with your automated assembly equipment requirements before placing orders.
Select this component when a dedicated audio processor LSI in a small form factor is required. The 154-ball WLCSP package suggests suitability for space-constrained designs. Verify compatibility with your system's power supply constraints and thermal management capabilities, as detailed electrical specifications are not currently available in the public data.
This part is part of onsemi's portfolio of audio integrated circuits. It falls under the broader category of audio special purpose devices, distinct from general-purpose logic or power management components. The specific model number indicates a particular configuration within the LC823460 series, tailored for specific audio processing needs.
No publicly confirmed substitute part numbers are available in the provided source material. Engineers should consult onsemi's official documentation or contact technical support directly to identify compatible alternatives if this specific variant becomes unavailable.
The component is packaged in a 154-ball Wafer Level Chip Scale Package (WLCSP).
According to the product details, it is supplied in Tape & Reel (TR) format.
It is an Audio Processor LSI designed for specialized audio processing applications.
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