Balun LDB181G7FAAEA046 product image

LDB181G7FAAEA046

$0.26
  • Description:BALUN LC 50/100 OHM 0.5W SMD
  • Series:LDB18
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:5a6f214ab844 Category: Brand:

  
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LDB181G7FAAEA046 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is BALUN LC 50/100 OHM 0.5W SMD. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB181G7FAAEA046

  • Description:BALUN LC 50/100 OHM 0.5W SMD
  • Series:LDB18
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:-
  • Impedance - Unbalanced/Balanced:-
  • Phase Difference:-
  • Insertion Loss (Max):-
  • Return Loss (Min):-
  • Package / Case:0603 (1608 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB181G7FAAEA046

LDB181G7FAAEA046

Balun Overview

The LDB181G7FAAEA046 is an RF balun from the Murata LDB18 series, designed for high-frequency applications. It operates within a frequency range of 2.4GHz to 2.5GHz. The component provides impedance transformation between unbalanced and balanced lines, specified as 50 ohms and 200 ohms respectively. It utilizes a surface-mount 0603 (1608 metric) package construction featuring copper conductors and ceramic material. The device is RoHS compliant and classified under EAR99.

Balun Feature Summary

  • Constructs a low-profile SMD using copper conductor and ceramic materials
  • Provides impedance conversion between 50-ohm and 200-ohm lines
  • Designed for operation in the 2.4GHz to 2.5GHz frequency band

Balun Applications

  • High-frequency RF circuit balancing
  • Wireless communication systems operating at 2.4GHz
  • Bluetooth module interface circuits

Balun Procurement Notes

Verify the specific suffix FA against official Murata documentation to confirm exact electrical tolerances and pinout configuration. Ensure the procurement source provides the original manufacturer datasheet rather than third-party summaries. Confirm that the received components match the 0603 package dimensions and lead-free specifications required by the design. Cross-reference the part number with current production status notices to avoid obsolete inventory.

Balun Selection Notes

Select this component when a compact 0603 footprint is required for 2.4GHz signal balancing. The 50/200 ohm impedance ratio suits specific transceiver architectures requiring this transformation. Consider the low-loss characteristics inherent to the chip multilayer hybrid construction. Evaluate thermal performance within the -55°C to +125°C operating range during system integration.

Balun Part Context

This balun belongs to the LDB18 series of chip multilayer hybrid baluns manufactured by Murata Electronics. These devices are engineered for microwave SMD applications, offering a balance between size reduction and signal integrity. The series supports various impedance configurations tailored for different wireless standards and RF front-end requirements.

Balun Replacement Considerations

LDB182G4520C-110 and LDB212G4020C-001 are listed as similar substitutes. Note that these alternatives differ in physical package size and specific frequency centering. Verify impedance matching and insertion loss compatibility before implementing any substitution.

LDB181G7FAAEA046LDB181G7FAAEA046
$0.26
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