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LDB182G8AAAEA050 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is BALUN. Review the specifications below when checking this part for your BOM.
The LDB182G8AAAEA050 is an RF balun manufactured by Murata Electronics, designed for high-frequency signal conversion. It operates within a frequency range of 1.58GHz to 4.025GHz and features a nominal impedance of 50Ω. The component supports a maximum power capacity of 1W and utilizes a 0603 (1608 Metric) surface-mount package with six PC pads. This device integrates copper conductors and ceramic materials to ensure low loss performance in compact applications.
Verify current availability status as the product lifecycle indicates end-of-life notification with discontinuation scheduled for August 31, 2025. Confirm that the ordering suffix does not alter functional specifications before finalizing procurement orders. Ensure compatibility with existing PCB footprints and reflow soldering profiles specified in the official datasheet.
Select this component when a 0603 footprint balun is required for frequencies between 1.58GHz and 4.025GHz. Consider the 50Ω impedance match and 1W power handling limits against circuit requirements. Evaluate the transition from through-hole or larger packages to this SMD solution for miniaturization needs while maintaining signal integrity.
This part belongs to Murata's LC Balun series, which focuses on chip-type SMD baluns. These components are engineered for high-frequency applications requiring minimal signal degradation. The series emphasizes reliability through the use of robust ceramic and copper construction methods typical of Murata's passive component manufacturing standards.
No public confirmed substitute part numbers are available in the provided documentation. Due to the end-of-life status, alternative sourcing should focus on verifying equivalent electrical parameters from other manufacturers if direct substitution is necessary.
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