Balun LDB183G4505G-120 product image

LDB183G4505G-120

$0.06
  • Description:MULTI-LAY HYBRID BALUNS
  • Series:LDB18
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:45d76a30e808 Category: Brand:

  
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LDB183G4505G-120 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB183G4505G-120

  • Description:MULTI-LAY HYBRID BALUNS
  • Series:LDB18
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:3.3GHz ~ 3.6GHz
  • Impedance - Unbalanced/Balanced:50 / 50Ohm
  • Phase Difference:-
  • Insertion Loss (Max):1.35dB
  • Return Loss (Min):-
  • Package / Case:-
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB183G4505G-120

LDB183G4505G-120

Balun Overview

The LDB183G4505G-120 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 3300 MHz to 3600 MHz, centered at 3.45 GHz. The component provides balanced and unbalanced impedance matching with both ports rated at 50 Ohms. It utilizes surface mount technology for board integration.

Balun Feature Summary

  • Hybrid balun architecture for RF signal conversion
  • Integrated impedance matching for balanced and unbalanced ports
  • Surface mount package design for automated assembly

Balun Applications

  • RF wireless communication systems
  • IF signal processing circuits
  • Balanced-to-unbalanced signal conversion

Balun Procurement Notes

Verify the current production status before procurement, as this specific part number is scheduled for obsolescence and will be discontinued by the manufacturer. Confirm availability through authorized distributors or check for valid replacement components that meet the same electrical specifications and physical footprint requirements.

Balun Selection Notes

Select this component when a 50-ohm hybrid balun is required for the 3.3 to 3.6 GHz frequency band. Ensure the application supports surface mount installation and requires precise impedance matching between balanced and unbalanced circuit sections without external discrete components.

Balun Part Context

This device belongs to the LDB series of chip multilayer hybrid baluns from Murata Electronics. These components are designed for signal conditioning in RF and IF applications, offering compact solutions for impedance transformation in modern electronic devices.

Balun Replacement Considerations

Due to the scheduled obsolescence of the LDB183G4505G-120, engineers must identify alternative baluns with compatible frequency ranges and impedance characteristics. Verify pinout compatibility and thermal performance when selecting substitutes.

LDB183G4505G-120LDB183G4505G-120
$0.06
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