Balun LDB183G6010G-120 product image

LDB183G6010G-120

$0.06
  • Description:MULTI-LAY HYBRID BALUNS
  • Series:LDB18
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)

SKU:2a8c8c734d20 Category: Brand:

  
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LDB183G6010G-120 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB183G6010G-120

  • Description:MULTI-LAY HYBRID BALUNS
  • Series:LDB18
  • Mfr:Murata Electronics
  • Package:Tape & Reel (TR)
  • Frequency Range:3.3GHz ~ 3.9GHz
  • Impedance - Unbalanced/Balanced:50 / 100Ohm
  • Phase Difference:-
  • Insertion Loss (Max):1.5dB
  • Return Loss (Min):-
  • Package / Case:-
  • Mounting Type:Surface Mount

Balun datasheet and documents for LDB183G6010G-120

LDB183G6010G-120

Balun Overview

The LDB183G6010G-120 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within a frequency range of 3.3 GHz to 3.9 GHz. The component provides impedance transformation between an unbalanced port and a balanced port, specified as 50 Ohms and 100 Ohms respectively. It utilizes surface mount technology for board integration.

Balun Feature Summary

  • Provides signal conditioning through hybrid balun functionality
  • Supports high-frequency operation in the 3.3 GHz to 3.9 GHz range
  • Facilitates impedance matching between unbalanced and balanced circuit paths

Balun Applications

  • RF front-end modules
  • Wireless communication systems
  • Signal conditioning circuits

Balun Procurement Notes

Verify the specific manufacturer part number against official Murata documentation to confirm technical specifications. Ensure compatibility with target RF design requirements before procurement. Check for current availability status as electronic components may undergo lifecycle changes.

Balun Selection Notes

Select this component based on its specific operating frequency range and impedance characteristics. Consider the physical package dimensions and mounting type for PCB layout constraints. Evaluate thermal performance and environmental ratings relative to the intended application environment.

Balun Part Context

This component belongs to the LDB series of chip multilayer hybrid baluns from Murata Electronics. These devices are designed for signal conditioning applications requiring conversion between balanced and unbalanced signals in high-frequency environments.

Balun Replacement Considerations

Consult official Murata documentation for verified substitute part numbers. Cross-reference technical parameters such as frequency range and impedance to ensure functional equivalence.

LDB183G6010G-120LDB183G6010G-120
$0.06
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