LDB18869M15G-120

Balun Overview

The LDB18869M15G-120 is a chip multilayer hybrid balun manufactured by Murata Electronics. It operates within the frequency range of 824 MHz to 915 MHz, centered at 869 MHz. The component provides an impedance transformation from 50 Ohms unbalanced to 150 Ohms balanced. It features a maximum insertion loss of 1.1 dB and utilizes SMD/SMT termination types in a compact 0603 (1608 metric) package.

Balun Feature Summary

• Hybrid balun design for signal conditioning applications
• Integrated impedance matching between unbalanced and balanced lines
• Compact surface-mount construction for automated assembly

Balun Applications

• RF circuit balancing in wireless communication modules
• Signal path conversion in ISM band transceivers
• Antenna interface networks for IoT devices

Balun Procurement Notes

This component has reached end-of-life status and is no longer manufactured by Murata Electronics. Procurement should focus on verifying availability through authorized distributors or secondary markets. Designers must confirm that existing stock meets current project requirements before committing to purchases, as supply continuity cannot be guaranteed.

Balun Selection Notes

Engineers should evaluate this part against active alternatives due to its discontinued status. Selection criteria must prioritize the specific 150 Ohm balanced impedance requirement and the 824-915 MHz operational bandwidth. Verify that the 0603 footprint and thermal characteristics align with the target PCB layout constraints.

Balun Part Context

The LDB series represents Murata's line of chip multilayer hybrid baluns designed for RF signal processing. This specific model belongs to the LDB family, which integrates passive components into a single substrate to reduce board space. It serves as a specialized solution for converting differential signals to single-ended formats in high-frequency applications.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Due to the end-of-life status, engineers must identify equivalent active components manually based on impedance, frequency, and package specifications.